NEETS, MODULE 14--INTRODUCTION TO MICROELECTRONICS
http://www.tpub.com/content/neets/14186

Presents information on the fundamental concepts of microelectronics, solid-state devices, and integrated circuits. Fabrication, packaging techniques, and equivalent circuits are discussed. Topic 2 discusses the Navy's 2M program including certification requirements, levels of maintenance, repair stations, 2M facilities, high-reliability soldering techniques, and test equipment. Topic 3 covers removal/replacement/repair of miniature and microminiature components, and safety precautions.

Assignment 1 NEETS, Module 14 Introduction to Microelectronics Chapter 1 Microelectronics and Chapter 2 Miniature/Microminiature (2m) Repair Program and High-Reliability Soldering
Test not yet available

http://www.tpub.com/content/neets/14186/css/14186_15.htm through
http://www.tpub.com/content/neets/14186/css/14186_92.htm

Assignment 2 NEETS, Module 14 Introduction to Microelectronics Chapter 3 Miniature and Microminiature Repair Procedures
Test not yet available

http://www.tpub.com/content/neets/14186/css/14186_93.htm through
http://www.tpub.com/content/neets/14186/css/14186_143.htm